Bonding means and method

Details Bonding means and method Bonding means and method

1989-05-25

1990-05-15

Godici, Nicholas P.

Metal fusion bonding

Process

Plural joints

228 45, 219 5621, B23K 2026, B23K 3100

Patent

active

049250850

ABSTRACT:
An improved means and method for bonding closely spaced parallel wires for applications in electronic devices, circuits and assemblies is described herein. A wire guiding means is provided located between a bonding wedge and a releasable wire clamp of a conventional wire bonder. The wire guide means has a slot which constrains motion of the wire during bonding to a plane perpendicular to the plane of the bonding pad and substantially prevents motion of the wire transverse to this perpendicular plane. This prevents the bonding from introducing minute variations in the transverse displacement of the wires, such variations being absorbed by small variations in the wire loop height.

REFERENCES:
patent: 3787966 (1974-01-01), Klossika
patent: 4418858 (1983-12-01), Miller

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