Bonding means and method

Details Bonding means and method Bonding means and method

1981-06-08

1983-11-15

Godici, Nicholas P.

Metal fusion bonding

Process

With shaping

228179, 228 45, B23K 3102

Patent

active

044151152

ABSTRACT:
A new wire bonding capillary design is employed in which the bonding and cutting surfaces of the bonding capillary are separated. The bonding capillary tip has an annular bonding surface and an annular cutting ridge raised from the bonding surface and of smaller diameter.

REFERENCES:
patent: 3087239 (1963-04-01), Clagett
patent: 3643321 (1972-02-01), Field
Jerry Lyman, Chip-Carriers Move into Prototyping, Electronics, Dec. 4, 1980, p. 48.

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