Bonding materials for anode to anode bonding and anode to interc

Chemistry: electrical current producing apparatus – product – and – Having earth feature

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

429 41, H01M 400

Patent

active

057028370

ABSTRACT:
An anode/anode bonding material for anode to anode material bonding in SOFC stacks, and an anode/interconnect bonding material for anode material to interconnect material bonding in SOFC stacks are provided. The anode/anode bonding material comprises powders of reactive ingredients, nickel oxide and zirconium oxide as the major components. The anode/interconnect bonding material comprises powders of reactive ingredients, nickel oxide, zirconium oxide, cobalt oxide, calcium oxide or strontium oxide as the major components. The reactive ingredients are selected from the compounds of tungsten, tantalum, niobium, molybdenum, and titanium. During the bonding operation at subsintering temperatures of 1000.degree.-1300.degree. C. the bonding materials react with anode and/or interconnect material to provide strong and reliable anode to anode bonds and/or anode to interconnect bonds that have a bonding strength greater than one megapascal. The respective bonds are compatible with anode and interconnect materials and are electrically conductive in SOFC operating environments.

REFERENCES:
patent: 5162167 (1992-11-01), Minh et al.
patent: 5290642 (1994-03-01), Minh et al.
patent: 5403461 (1995-04-01), Tuller et al.
patent: 5480737 (1996-01-01), Sotake et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Bonding materials for anode to anode bonding and anode to interc does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Bonding materials for anode to anode bonding and anode to interc, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Bonding materials for anode to anode bonding and anode to interc will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-200884

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.