Bonding material for planar electronic device

Details Bonding material for planar electronic device Bonding material for planar electronic device

1974-05-22

1977-06-14

Lieberman, Allan

Chemistry of carbon compounds

Miscellaneous organic carbon compounds

260 328A, 260 328N, 260 328SB, 260 328EP, 428901, C08K 507

Patent

active

040296288

ABSTRACT:
A composition for bonding integrated circuits to a heat sink and conducting eat therebetween. The composition is comprised of a thermoplastic polymer resin adhesive for supplying the bonding strength, a solvent for softening the adhesive to a putty like substance, and a filler for increasing the thermal conductivity of the adhesive.

REFERENCES:
patent: 2721153 (1955-10-01), Hopf et al.
patent: 3384679 (1968-05-01), Stetz
patent: 3405066 (1968-10-01), McGhee et al.
patent: 3625758 (1971-12-01), Stahl et al.
patent: 3703568 (1972-11-01), Kadowaki et al.

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