Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1997-03-27
1998-11-03
Thompson, Gregory
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361689, 361699, 361700, 257714, 257707, 257712, 257713, H05K 720
Patent
active
058318313
ABSTRACT:
There is disclosed herein an electronic circuit assembly using a bonding material/phase change material system for electronic device heat burst dissipation. One embodiment of the assembly comprises: a substrate having a substrate surface with a preselected mounting site located thereon; a predetermined amount of phase change material disposed on the substrate surface at the preselected mounting site; a predetermined amount of bonding material arranged on the substrate surface at the preselected mounting site so as to substantially surround the predetermined amount of phase change material; and an electronic device having a heatspreader portion, the device being oriented such that the heatspreader portion is positioned at the preselected mounting site over the predetermined amounts of phase change material and bonding material, the heatspreader portion being attached to the substrate surface by the bonding material.
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Chervinsky Boris L.
Ford Motor Company
Hodges Leslie C.
Thompson Gregory
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