Bonding machine of electronic components and bonding method ther

Details Bonding machine of electronic components and bonding method ther Bonding machine of electronic components and bonding method ther

1996-09-26

1998-11-24

Ryan, Patrick

Metal fusion bonding

Process

Plural joints

228 62, 228 447, 228 495, B23K 3102

Patent

active

058396454

ABSTRACT:
A bonding machine bonds electronic components to a substrate and makes it possible to prevent the breakage of wires from occurring without use of slip rings. A first terminal is connected to a thermal pressing head through a wire and is installed on a rotating member. A second terminal is connected to an electric power supply through a wire and is installed below the rotating member. The first terminal and second terminal contact only when electric current is supplied to the thermal pressing head. Both contacts are separated when the thermal pressing head releases the electronic component and is moved away from the substrate.

REFERENCES:
patent: 3357621 (1967-12-01), Badini et al.
patent: 5579985 (1996-12-01), Ichikawa

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