Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1998-02-27
1999-11-09
Sells, James
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156358, 156359, 1565831, B29C 6552
Patent
active
059806630
DESCRIPTION:
BRIEF SUMMARY
The present invention relates to apparatus and methods for bonding generally.
Many adhesives used to bond materials require application of pressure and/or heat to achieve a successful bond. Bonding relatively delicate materials, or substrates which include sensitive components, such as in the field of microelectronics, demands special care in the proper application of heat and pressure. Excessive heat or pressure may damage sensitive components.
In addition, maintaining a uniformly thin layer of adhesive between the bonded materials is often critical for proper functioning of the finished part.
The present invention seeks to provide apparatus and a method for application of a uniformly thin layer of adhesive between materials wherein significantly less pressure and heat is required to achieve the same bond than for techniques known in the art.
There is thus provided in accordance with a preferred embodiment of the present invention a method of bonding a lower substrate with an upper substrate including applying an adhesive on at least one of the lower and the upper substrates, and rotating the lower and the upper substrates thereby to create a centrifugal force which causes the adhesive to spread between the lower and the upper substrates with a substantially uniform thickness, while applying a pressure upon the upper substrate thereby to bond the lower and the upper substrates.
In accordance with a preferred embodiment of the present invention, the method additionally includes heating at least one of the lower and the upper substrates.
Further in accordance with a preferred embodiment of the present invention, the method includes controlling the temperature of at least one of the lower and the upper substrates.
Further in accordance with a preferred embodiment of the present invention, the method includes controlling the pressure applied upon the upper substrate.
There is also provided in accordance with a preferred embodiment of the present invention a bonding machine including a lower chuck adapted to fixedly receive a lower substrate, an upper chuck rotatably engageable with the lower chuck and operative to apply a pressure upon the upper substrate when positioned upon the lower substrate, a rotator operative to rotate the lower chuck, thereby to create a centrifugal force which causes an adhesive applied on at least one of the lower and the upper substrates to spread therebetween with a substantially uniform thickness, and wherein application of the pressure by the upper chuck upon the upper substrate causes bonding of the lower and the upper substrates.
Additionally in accordance with a preferred embodiment of the present invention, at least one of the lower and the upper chucks includes a heater.
Further in accordance with a preferred embodiment of the present invention, at least one of the lower and the upper chucks includes a temperature sensor which communicates with a controller for temperature control of at least one of the lower and the upper chucks.
Still further in accordance with a preferred embodiment of the present invention, the lower chuck includes at least one engagement element and the upper chuck includes at least one engagement arm for selectable engagement with the at least one engagement element.
Additionally in accordance with a preferred embodiment of the present invention, there is provided an orientation sensor operative to sense the position of the at least one engagement arm and to signal the rotator to rotate the lower chuck such that the at least one engagement element is oriented to be in engageable orientation with respect to the at least one engagement arm.
In accordance with a preferred embodiment of the present invention, the rotator is a variable speed servomotor.
Further in accordance with a preferred embodiment of the present invention, there is provided a motion device for selectably moving the upper chuck generally vertically with respect to the lower chuck.
Still further in accordance with a preferred embodiment of the present invention, there is provided a pres
REFERENCES:
patent: 4636124 (1987-01-01), Gugle et al.
patent: 4795524 (1989-01-01), Sakaida et al.
Sells James
Shellcase Ltd.
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