Bonding load correction method and wire bonding apparatus

Details Bonding load correction method and wire bonding apparatus Bonding load correction method and wire bonding apparatus

1998-05-06

2000-08-01

Ryan, Patrick

Metal fusion bonding

With means to juxtapose and bond plural workpieces

Wire lead bonder

228102, 228111, 228 11, B23K 3700, B23K 106, B23K 520

Patent

active

060953969

ABSTRACT:
A wire bonding method and apparatus using a computer that has a memory which stores correction values that correct positional discrepancies in the height position of a bonding arm and limit values that limit an electric power not only in a state in which no load is applied but also in a state in which a weight is mounted on a supporting frame so that a load equal to a bonding load is applied to a linear motor that raises and lowers the bonding arm.

REFERENCES:
patent: 5044543 (1991-09-01), Yamazaki et al.
patent: 5060841 (1991-10-01), Oshima et al.
patent: 5156320 (1992-10-01), Yanagida
patent: 5176310 (1993-01-01), Akiyama et al.
patent: 5443200 (1995-08-01), Arikado
patent: 5501388 (1996-03-01), Takeuchi
patent: 5566876 (1996-10-01), Nishimaki et al.

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