Bonding lead structure with enhanced encapsulation

Details Bonding lead structure with enhanced encapsulation Bonding lead structure with enhanced encapsulation

1997-10-08

1999-08-10

Picardat, Kevin M.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

438127, 438458, H01L 2144, H01L 2148, H01L 2150

Patent

active

059372761

ABSTRACT:
A connection component for a semiconductor chip includes a support structure having a top surface including a dielectric material and a bottom surface. The support structure includes a central portion, a peripheral portion and one or more gaps extending substantially between the central portion and the peripheral portion. A bus overlies the top surface of the support structure. The each bus has an outer edge which overlies the peripheral portion of the support structure and an inner edge which overlies the one or more gaps. The support structure also includes one or more electrically conductive leads having first ends secured to the central portion and second ends overlying the gaps and being secured to the inner edge of the bus. The second ends of the leads are displaceable relative to the bus in response to bonding forces being applied to the leads for engaging contacts on a semiconductor chip.

REFERENCES:
patent: 2758797 (1956-08-01), Miklau
patent: 3374537 (1968-03-01), Doelp, Jr.
patent: 3390308 (1968-06-01), Marley
patent: 3426252 (1969-02-01), Lepselter
patent: 3460105 (1969-08-01), Birt et al.
patent: 3487541 (1970-01-01), Boswell
patent: 3517438 (1970-06-01), Johnson et al.
patent: 3614832 (1971-10-01), Chance et al.
patent: 3680037 (1972-07-01), Nellis et al.
patent: 3680206 (1972-08-01), Roberts
patent: 3683105 (1972-08-01), Shamash et al.
patent: 3684818 (1972-08-01), Netherwood
patent: 3772575 (1973-11-01), Hegarty et al.
patent: 3795037 (1974-03-01), Luttmer
patent: 3822465 (1974-07-01), Frankort et al.
patent: 3832769 (1974-09-01), Olyphant, Jr. et al.
patent: 3862790 (1975-01-01), Davies et al.
patent: 3864728 (1975-02-01), Peltz et al.
patent: 3868724 (1975-02-01), Perrino
patent: 4030657 (1977-06-01), Scheffer
patent: 4069961 (1978-01-01), Nicklaus
patent: 4141712 (1979-02-01), Rogers
patent: 4179802 (1979-12-01), Joshi et al.
patent: 4234666 (1980-11-01), Gursky
patent: 4237607 (1980-12-01), Ohno
patent: 4312926 (1982-01-01), Burns
patent: 4320570 (1982-03-01), Williams
patent: 4331740 (1982-05-01), Burns
patent: 4380042 (1983-04-01), Angelucci, Sr. et al.
patent: 4413404 (1983-11-01), Burns
patent: 4435741 (1984-03-01), Shimizu et al.
patent: 4545610 (1985-10-01), Lakritz et al.
patent: 4574470 (1986-03-01), Burt
patent: 4604644 (1986-08-01), Beckham et al.
patent: 4616406 (1986-10-01), Brown
patent: 4616412 (1986-10-01), Schroeder
patent: 4627151 (1986-12-01), Mulholland et al.
patent: 4628406 (1986-12-01), Smith et al.
patent: 4633583 (1987-01-01), Kato
patent: 4670770 (1987-06-01), Tai
patent: 4681654 (1987-07-01), Clementi et al.
patent: 4685998 (1987-08-01), Quinn et al.
patent: 4709468 (1987-12-01), Wilson
patent: 4710798 (1987-12-01), Marcantonio
patent: 4721993 (1988-01-01), Walter
patent: 4751199 (1988-06-01), Phy
patent: 4751482 (1988-06-01), Fukuta et al.
patent: 4756080 (1988-07-01), Thorp, Jr. et al.
patent: 4776509 (1988-10-01), Pitts et al.
patent: 4793814 (1988-12-01), Zifcak et al.
patent: 4796078 (1989-01-01), Phelps, Jr. et al.
patent: 4811082 (1989-03-01), Jacobs et al.
patent: 4812421 (1989-03-01), Jung et al.
patent: 4814295 (1989-03-01), Mehta
patent: 4855867 (1989-08-01), Gazdik et al.
patent: 4859806 (1989-08-01), Smith
patent: 4874721 (1989-10-01), Kimura et al.
patent: 4878098 (1989-10-01), Saito et al.
patent: 4884122 (1989-11-01), Eichelberger et al.
patent: 4887758 (1989-12-01), Suzuki et al.
patent: 4941033 (1990-07-01), Kishida
patent: 4967261 (1990-10-01), Niki et al.
patent: 4989069 (1991-01-01), Hawkins
patent: 5007576 (1991-04-01), Congleton et al.
patent: 5010038 (1991-04-01), Fox et al.
patent: 5057461 (1991-10-01), Fritz
patent: 5059559 (1991-10-01), Takahashi et al.
patent: 5065504 (1991-11-01), Olla
patent: 5065506 (1991-11-01), Kirbiyashi
patent: 5127570 (1992-07-01), Steitz et al.
patent: 5148166 (1992-09-01), Khandros et al.
patent: 5148265 (1992-09-01), Khandros et al.
patent: 5148967 (1992-09-01), Gabaldon et al.
patent: 5156318 (1992-10-01), Suzuki et al.
patent: 5173574 (1992-12-01), Kraus
patent: 5177863 (1993-01-01), Lam
patent: 5193732 (1993-03-01), Interrante et al.
patent: 5217154 (1993-06-01), Elwood et al.
patent: 5225633 (1993-07-01), Wigginton
patent: 5252784 (1993-10-01), Asai et al.
patent: 5390844 (1995-02-01), Distefano et al.
patent: 5477611 (1995-12-01), Sweis et al.
patent: 5489749 (1996-02-01), DiStefano et al.
patent: 5536909 (1996-07-01), DiStefano et al.
patent: 5565386 (1996-10-01), Bearden et al.
patent: 5663106 (1997-09-01), Karavakis et al.
"Recent Advances in Single Point Tab Bonding Tools", by Jerry Carlson Microminiature Technology, Inc.

Affiliated with

Also associated with

Rating

Bonding lead structure with enhanced encapsulation does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Bonding lead structure with enhanced encapsulation, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Bonding lead structure with enhanced encapsulation will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1129989