Bonding head for an ultrasonic bonding machine

Details Bonding head for an ultrasonic bonding machine Bonding head for an ultrasonic bonding machine

1993-12-10

1995-09-26

Rosenbaum, Mark

Metal fusion bonding

Means to apply vibratory solid-state bonding energy to work

228 45, 228 13, B23K 2010

Patent

active

054528380

ABSTRACT:
A bonding head for an ultrasonic bonding machine comprises a wedge operatively associated with an ultrasound transducer by means of which an electrically conducting wire can be pressed against a contact surface of an electrical or electronic component and bonded thereto by ultrasonic excitation of the wedge. A wire clamp is located adjacent to and ahead of the wedge and can be moved back and forth by drive means in the direction of the wire being fed to the wedge. The wedge can be moved up and down together with the wire clamp and its drive means in a direction substnatially perpendicular to the contact surface. The bonding head as a whole is also disposed so that it can be swung about an axis perpendicular to the contact surface. The drive means for wire clamp comprises a translational drive which can move the wire clamp exactly parallel to the direction of the wire being fed to the wedge.

REFERENCES:
patent: 3718272 (1973-02-01), Eltzroth et al.
patent: 4068371 (1978-01-01), Miller
patent: 4619397 (1986-10-01), Urban
patent: 4781319 (1988-11-01), Deubzer et al.
patent: 4789093 (1988-12-01), Bansemir
patent: 4976392 (1990-12-01), Smith et al.

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