Bonding head

Details Bonding head Bonding head

1997-03-25

1999-09-14

Evans, Geoffrey S.

Metal fusion bonding

Means to apply vibratory solid-state bonding energy to work

228 45, H01L 2160

Patent

active

059509031

ABSTRACT:
A bonding head is provided for a wire bonding machine which includes a wedge (2) connected to a transducer (3) for applying pressure and ultrasonic energy to a wire (1) guided into contact with a substrate to which a bond is to be formed. A support system (7, 8, 9) is provided for simultaneously securing the transducer (3) to the bonding head frame (12) and variably adjusting the contacting pressure of the wire to the substrate. Springs (9a, 9b), preferably leaf springs, urge the transducer (3), while a linear actuator (8) is arranged to variably tension the springs (9a, 9b) to adjust the bond force.

REFERENCES:
patent: 5060841 (1991-10-01), Oshima et al.
patent: 5277355 (1994-01-01), Weaver et al.
patent: 5452838 (1995-09-01), Farassat

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