Bonding head

Metal fusion bonding – With means to juxtapose and bond plural workpieces – Wire lead bonder

Patent

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Details

228 11, B23K 3700

Patent

active

047813199

ABSTRACT:
A bonding head (10) of a wire bonding machine for bonding wire to electronic or electronical components comprises a bonding tool (18) connected to an ultrasonic transducer (16), a wire spool (22) mounted at the opposite side of the head to the transducer (16), and (optionally) a guide (60) including a tubular member (62) adjustably mounted on the head (10) having an inlet end through which wire (20) from the spool (22) passes and an outlet end (64) adjacent the bonding tip (19), the guide (60) being mounted for angular movement on an arm (70) itself pivotally mounted whereby the angle of the guide (60) can be adjusted while maintaining the outlet end (64) in position adjacent the bonding tip (19). Thus the wire (20) can be supplied to the tool (18) at a variety of different angles according to the component to which the wire is to be bonded.

REFERENCES:
patent: 3342972 (1967-09-01), Penberg
patent: 3643321 (1972-02-01), Field et al.
patent: 3734386 (1973-05-01), Hazel
patent: 4053096 (1977-10-01), Heim
patent: 4069961 (1978-01-01), Nicklaus et al.
patent: 4202482 (1980-05-01), Sade et al.
patent: 4205773 (1980-06-01), Nicklaus
patent: 4437603 (1984-03-01), Kobayashi et al.
patent: 4550871 (1985-11-01), Chan et al.
patent: 4576322 (1986-03-01), Figueredo

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