Bonding flexible film circuit and electronic circuit board

Details Bonding flexible film circuit and electronic circuit board Bonding flexible film circuit and electronic circuit board

2008-09-23

2008-09-23

Goff, John L (Department: 1791)

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

Presses or press platen structures, per se

C156S583100, C100S193000, C100S25800A

Reexamination Certificate

active

11008490

ABSTRACT:
Two circuit bearing substrates, such as a rigid electronic circuit board and a flexible circuit film, each having large arrays or multiple arrays of surface contact pads or traces, are mechanically and electrically joined without relocating the substrates during the bonding process by using a bonding apparatus with multiple working tools or bond shoes. The bonding apparatus includes a fixture for holding the circuit bearing substrates with a joining layer between them, and two or more independently operated heated bond shoes that compress different portions of the circuit bearing substrates with the joining layer, such as a layer of anisotropic conductive film.

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