Bonding electronic component to molded package

Details Bonding electronic component to molded package Bonding electronic component to molded package

1978-11-07

1980-10-28

Robinson, Ellis P.

Stock material or miscellaneous articles

Sheet including cover or casing

Complete cover or casing

174 52PE, 357 72, 264272, 264135, 428391, 428417, 428447, 428450, 428413, H01L 2328, B32B 2738

Patent

active

042307546

ABSTRACT:
An electronic component with leads attached is cleaned, a layer of an epoxy or epoxy-reactive silane is applied and cured, and then the package material is molded on. The silane layer bonds the component to the package and provides a fluid-tight seal therebetween. The silane is gamma-glycidoxypropyl- or gamma-aminopropyltrimethoxy or triethoxy silane.

REFERENCES:
patent: 2946701 (1960-07-01), Plueddemann
patent: 3652333 (1972-03-01), Warren
patent: 3749601 (1973-07-01), Tittle
patent: 3772079 (1973-11-01), Louzon
patent: 3788895 (1974-01-01), Schimmer
patent: 3824328 (1974-07-01), Ting
patent: 3849187 (1974-11-01), Fetscher
patent: 3911475 (1975-10-01), Szedon
patent: 3915780 (1975-10-01), Broussard
patent: 3946427 (1976-03-01), Iwasawa
patent: 4048356 (1977-09-01), Bakos
"Silane Coupling Agents", Dow Corning Corporation, 1970 p. 29-31.

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