Metal fusion bonding – Process – Alternative bonding
Patent
1990-12-20
1991-12-31
Heinrich, Samuel M.
Metal fusion bonding
Process
Alternative bonding
2281802, 228248, 156276, 156297, H05K 332
Patent
active
050764853
ABSTRACT:
Bonding a plurality of TAB tape leads to electrical pads in and aligned with the surface of a die by covering the pads with a plurality of electrically conductive particles, aligning the electrical leads with the particles and the pads, and simultaneously bonding the particles to the pads and the electrical leads to the particles so that each bonded particle is between and in contact with a pad and a lead. Preferably the particles are solid spheres 1.0 mils in diameter. The spheres may be applied by covering the entire surface with the spheres, covering the pads with an adhesive material prior to the spheres, or covering the pads with a mixture of vehicle and spheres.
REFERENCES:
patent: 3303393 (1967-02-01), Hymes et al.
patent: 3382568 (1968-05-01), Kuiper
patent: 3401055 (1968-09-01), Langdon et al.
patent: 3731377 (1973-05-01), Muckelroy
patent: 3900153 (1975-08-01), Beerwerth et al.
patent: 4332341 (1982-06-01), Minetti
patent: 4410774 (1968-11-01), Barson et al.
patent: 4442966 (1984-04-01), Jourdain et al.
patent: 4604644 (1986-08-01), Beckham et al.
patent: 4749120 (1988-06-01), Hatada
patent: 4763409 (1988-08-01), Takekawa et al.
patent: 4776509 (1988-10-01), Pitts et al.
patent: 4845335 (1989-07-01), Andrews et al.
patent: 4995551 (1991-02-01), MacKay
Totta et al, "SLT Device Metallurgy and Its Monolithic Extension", IBM Journal of Research Development, pp. 226-238 (May, 1969).
Miller, "Controlled Collapse Reflow Chip Joining", IBM Journal of Research Development pp. 239-250 (May, 1969).
Hatada et al, "New Film Carrier Assembly Technology" Transferred Bump Tab, IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol. CHMT-10, No. 3, pp. 335-340 (Sep., 1987).
Hatada et al, "Application to the Electronic Instrument by Transferred Bump-TAB Technology", Proceedings of the 1987 International Symposium on Microelectronics, pp. 649-653 (Sep. 1987).
Hatada et al, "Application to the Electronic Instrument by Transferred Bump-TAB Technology", Proceedings of the Third IEEE/CHMT International Electronic Manufacturing Technology Symposium, pp. 81-86 (Oct., 1987).
Hatada et al, "Bump Property for High Bondability and Reliability in Transferred Bump Tab Assembly Technology", IMC 1988 Proceedings, pp. 440-443, (May 1988).
Heinrich Samuel M.
Microelectronics and Computer Technology Corporation
Sigmond David M.
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