Bonding electrical leads to pads on electrical components

Details Bonding electrical leads to pads on electrical components Bonding electrical leads to pads on electrical components

1990-04-24

1991-02-26

Heinrich, Sam

Metal fusion bonding

Process

Alternative bonding

2281802, 228248, H05K 332

Patent

active

049955519

ABSTRACT:
Bonding a plurality of TAB tape leads to electrical pads in and aligned with the surface of a die by covering the pads with a plurality of electrically conductive particles, aligning the electrical leads with the particles and the pads, and simultaneously bonding the particles to the pads and the electrical leads to the particles. Preferably the particles are solid spheres and may be applied in various ways such as covering the entire surface with the spheres, covering the pads with an adhesive material prior to the spheres, or covering the pads with a mixture of adhesive and spheres. The method is particularly well suited for flip chip bonding.

REFERENCES:
patent: 3382568 (1968-05-01), Kuiper
patent: 3731377 (1973-05-01), Muckelroy
patent: 3900153 (1975-08-01), Beerwerth et al.
patent: 4332341 (1982-06-01), Minetti
patent: 4442966 (1984-04-01), Jourdain et al.
patent: 4604644 (1986-08-01), Beckham et al.
patent: 4749120 (1988-06-01), Hatada
patent: 4763409 (1988-08-01), Takekawa et al.

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