Bonding electrical conductors

Details Bonding electrical conductors Bonding electrical conductors

1990-07-10

1991-10-08

Heinrich, Samuel M.

Metal fusion bonding

Process

With measuring, testing, indicating, inspecting, or...

228179, H01L 2166

Patent

active

050546805

ABSTRACT:
A method of bonding an electrical conductor to a contact of an integrated circuit (IC) device comprises bonding the conductor to a support member and to a contact of the IC device. The conductor is then severed to release the IC device and conductor from the support. This allows the IC device to be tested while connected to the support member and provides it with a conductor lead for connection to a carrier for use.

REFERENCES:
patent: 4441248 (1984-04-01), Sherman et al.
patent: 4979663 (1990-12-01), Sofia et al.

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