Metal fusion bonding – Process – Using high frequency vibratory energy
Reexamination Certificate
2007-01-02
2007-01-02
Johnson, Jonathan (Department: 1725)
Metal fusion bonding
Process
Using high frequency vibratory energy
C228S001100
Reexamination Certificate
active
10829653
ABSTRACT:
A bonding device is for bonding an object to be bonded under pressure to a surface to be bonded by allowing a load and vibration to act on the object to be bonded. The bonding device includes a bonding tool14abutting on the object to be bonded, and a pressing unit pressing the bonding tool to the object to be bonded. The bonding tool includes a transversely elongated horn, a vibrator17applying a longitudinal vibration to the horn15in a first direction along the longitudinal direction of the horn a protruding part30protruding from the horn in a second direction substantially perpendicular to the first direction, a bonding operation part31provided in the end part of the protruding part30to abut on the object to be bonded, and a heating unit inserted into a mounting hole provided in the horn. The heating unit is mounted into the mounting hole with a space maintained from the inner surface of the mounting hole.
REFERENCES:
patent: 4534811 (1985-08-01), Ainslie et al.
patent: 5142117 (1992-08-01), Hoggatt et al.
patent: 5240166 (1993-08-01), Fontana et al.
patent: 5397407 (1995-03-01), D'Addario
patent: 6564988 (2003-05-01), Shiraishi et al.
patent: 2003/0038158 (2003-02-01), Takahashi et al.
patent: 2003/0066863 (2003-04-01), Skogsmo et al.
patent: 0 761 371 (1997-03-01), None
patent: 2000-200961 (2000-07-01), None
patent: WO 3/081644 (2003-10-01), None
Hizukuri Masafumi
Takahashi Seiji
Matsushita Electric - Industrial Co., Ltd.
Pearne & Gordon LLP
LandOfFree
Bonding device and bonding tool does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Bonding device and bonding tool, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Bonding device and bonding tool will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3798914