Bonding device

Details Bonding device Bonding device

2007-06-05

2007-06-05

Trinh, Minh (Department: 3729)

Metal working

Means to assemble or disassemble

Means to assemble electrical device

C029S759000, C029S761000

Reexamination Certificate

active

10637617

ABSTRACT:
A bonding device. A plurality of bonding units each has a base and a fastening member. Each base has a first connecting portion, a second connecting portion, and a stopper. An electronic device has a circuit unit and a predetermined element. The circuit unit has several first positioning portions and the predetermined element has several second positioning portions. The first positioning portions and the second positioning portions are through holes. When the predetermined element is attached to the upper surface of the circuit unit by aligning the second positioning portions with the corresponding first positioning portions, the second connecting portion of the base is first fit into the first positioning portions of the circuit unit, then the fastening member passes through the second positioning portion of the predetermined element to couple with the fastening member by several turns. Thus, the predetermined element is fixed on the circuit unit.

REFERENCES:
patent: 5901039 (1999-05-01), Dehaine et al.
patent: 6112378 (2000-09-01), Lee
patent: RE36968 (2000-11-01), Shieh
patent: 6243264 (2001-06-01), Bollesen et al.
patent: 6545879 (2003-04-01), Goodwin
patent: 6711810 (2004-03-01), Buley et al.
patent: 6826054 (2004-11-01), Liu
patent: 6859367 (2005-02-01), Davison
patent: 7028389 (2006-04-01), Chang

Affiliated with

Also associated with

Rating

Bonding device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Bonding device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Bonding device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3869539