Bonding data setting device and method

Details Bonding data setting device and method Bonding data setting device and method

2005-05-31

2005-05-31

Picard, Leo (Department: 2125)

Data processing: generic control systems or specific application

Specific application, apparatus or process

Product assembly or manufacturing

C700S180000, C345S645000

Reexamination Certificate

active

06901305

ABSTRACT:
For facilitating and making more efficient the setting of the operating parameters of a bonding tool that is used to form a wire loop into a desired shape, when an editing handle is dragged, the loop shape of a wire loop line drawing displayed on a display screen is redrawn as a secondary loop line drawing. The values of the operating parameters corresponding to the loop shape of the drawn or redrawn secondary loop line drawing are calculated, and the results are displayed in a parameter list.

REFERENCES:
patent: 5483626 (1996-01-01), Nakayama
patent: 6564115 (2003-05-01), Kinnaird

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