Bonding copper leads to gold film coatings on alumina ceramic su

Details Bonding copper leads to gold film coatings on alumina ceramic su Bonding copper leads to gold film coatings on alumina ceramic su

1977-04-11

1978-06-27

Kelly, Donald G.

Metal fusion bonding

Process

Metal to nonmetal with separate metallic filler

228159, 228179, 228254, 228904, B23K 3102

Patent

active

040969835

ABSTRACT:
A process for thermocompression bonding a copper wire lead to gold film on alumina ceramic substrate by use of a gold interface. The three step process involves: (1) thermocompressing a gold lead with a die-formed head to the gold film, (2) removing the gold lead to form a gold die-formed head bonding pad, and (3) thermocompressing the copper lead to the gold die-formed head bonding pad.

REFERENCES:
patent: 3159462 (1964-12-01), Kadelburg
patent: 3273979 (1966-09-01), Budnick
patent: 3296692 (1967-01-01), Griffin
patent: 3593412 (1971-07-01), Foote
patent: 3662454 (1972-05-01), Miller
patent: 3839780 (1974-10-01), Freedman
patent: 3986255 (1976-10-01), Mandal

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