Bonding coordinate teaching method and teaching means

Details Bonding coordinate teaching method and teaching means Bonding coordinate teaching method and teaching means

1995-04-27

1996-12-03

Ramsey, Kenneth J.

Metal fusion bonding

Process

With condition responsive, program, or timing control

228 45, 228 9, 228105, 348 95, H01L 2160

Patent

active

055799841

ABSTRACT:
In wire bonding used in manufacturing, for example, semiconductor devices, inputting of the coordinates of the first and second leads of a lead frame, on which a semiconductor chip is installed, into an operation controller makes it possible that the coordinates of all of the remaining leads are automatically calculated by an image processor and the bonding coordinates for such leads are also automatically calculated.

REFERENCES:
patent: 4972311 (1990-11-01), Holdgrafer et al.
patent: 4984731 (1991-01-01), Imamura
patent: 5119436 (1992-06-01), Holdgrafer
patent: 5121870 (1992-06-01), Evans, Jr. et al.
patent: 5123585 (1992-06-01), Terakado et al.
patent: 5350106 (1994-09-01), Fogal

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