Bonding contact members to circuit boards

Details Bonding contact members to circuit boards Bonding contact members to circuit boards

1975-03-31

1976-06-22

Smith, Al Lawrence

Metal fusion bonding

Process

Using a compliant cushioning medium

228119, 29401E, 29625, H05K 324, H05K 106

Patent

active

039646661

ABSTRACT:
In a thermocompressive soldering process, a conductive overlay of a material such as gold is applied to a contact finger of a circuit board.
In carrying out this process, the overlay is initially carried on an adhesively coated strip such as a polyimide tape. To transfer the overlay to the contact finger, it is aligned with the contact finger and temporarily attached to the circuit board. A heat conductive resilient sheet is then interposed between the circuit board and a thermode. The thermode is adjusted to engage the contact finger with a predetermined force. The force is resiliently distributed by the interposed sheet. Heat is then applied from the thermode through the resilient sheet to liquefy a solder coating on the overlay and to bond the overlay to the contact finger upon resolidification of the solder. The applied force is sustained during the application of head and during a subsequent cooling period during which the solder resolidifies. The resilient sheet minimizes seepage of solder to the top surface of the overlay and thereby prevents contamination of such surface by the solder.

REFERENCES:
patent: 2625737 (1953-01-01), Spooner
patent: 3257537 (1966-06-01), Clark
patent: 3374531 (1968-03-01), Bruce
patent: 3406246 (1968-10-01), Davidson et al.
patent: 3537175 (1970-11-01), Clair et al.
patent: 3765076 (1973-10-01), Brandt

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