Bonding contact members to circuit boards

Details Bonding contact members to circuit boards Bonding contact members to circuit boards

1976-04-02

1978-03-28

Reynolds, Bruce A.

Electricity: conductors and insulators

Conduits, cables or conductors

Single duct conduits

H05K 107

Patent

active

040816010

ABSTRACT:
A circuit pattern on a circuit board has at least one contact finger termination to be coupled to a connector contact. A conductive overlay is solder-bonded to the base metal of the contact finger. The overlay is a composite structure of a number of layers. A base layer of copper faces, and is solder-bonded, to the base. A surface layer of gold provides a contact area for the connector contact. A layer of nickel between the base layer and the surface layer acts as a barrier layer to prevent copper from migrating through the surface layer to deposit as a contaminant on the surface of the contact area.

REFERENCES:
patent: 3278887 (1966-10-01), Travis
patent: 3515950 (1970-06-01), Koons et al.
patent: 3554821 (1971-01-01), Caulton et al.
patent: 3765076 (1973-10-01), Brandt
patent: 3781596 (1973-12-01), Galli et al.

Affiliated with

Also associated with

Rating

Bonding contact members to circuit boards does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Bonding contact members to circuit boards, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Bonding contact members to circuit boards will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-643606