Bonding configuration structure for facilitating electrical...

Details Bonding configuration structure for facilitating electrical... Bonding configuration structure for facilitating electrical...

2006-04-18

2006-04-18

Nguyen, Vincent Q. (Department: 2858)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C228S103000

Reexamination Certificate

active

07030622

ABSTRACT:
A bonding configuration structure for facilitating electrical testing in a bonding process and a testing method are provided. The bonding configuration includes a bonded component, a bonding component, a bond portion and a leading component. The bonding component is disposed on the bonded component. The bonding component has a first end and a second end. The first end is coupled to the bond portion. The second end is disposed on the bonded component to form the first testing portion.

REFERENCES:
patent: 5517752 (1996-05-01), Sakata et al.
patent: 6241146 (2001-06-01), Wienand et al.
patent: 2001/0019169 (2001-09-01), Marino et al.

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