Bonding beryllium to copper alloys using powder metallurgy compo

Powder metallurgy processes – Powder metallurgy processes with heating or sintering – Making composite or hollow article

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

419 7, 419 48, B22F 310

Patent

active

059013362

ABSTRACT:
A process for bonding a first metal such as beryllium to a second metal such as a copper alloy using a powder metallurgy compositional gradient. According to one aspect of the present invention, a sequence of powder layers is located between beryllium and copper alloy pieces, the layers containing mixtures of a beryllium powder and a copper powder, e.g., of a copper alloy, high purity copper and/or the like. The composition of the layers is adjusted such that the layer adjacent the beryllium piece is beryllium rich, and so that the layers become progressively richer in copper as they get closer to the copper piece. The variation in composition between the pieces produces the compositional gradient. Bonding of the beryllium and copper alloy pieces is then accomplished by a hot consolidation technique such as hot isostatic pressing, vacuum hot pressing, solid state bonding or diffusion bonding at a temperature generally within a range of 500.degree. and 800.degree. C. The resulting bond strength is in excess of about 35 MPa at a temperature generally within a range of room temperature and 400.degree. C.

REFERENCES:
patent: 3515188 (1970-06-01), Lebedev et al.
patent: 5198154 (1993-03-01), Yokoyama et al.
patent: 5579534 (1996-11-01), Itoh et al.
patent: 5707725 (1998-01-01), Feldstein et al.
McDonnell Douglas, "U.S. Design Support Study for the ITER Divertor", Summary Report, Feb.-Sep., 1993.
Altmann et al., "An Analysis of Induction Brazed beryllium on Copper Alloy Substrates", 15th IEEE Symposium on Fusion Engineering, Hyannis, MA, Oct. 11-15, 1993.
Ibbot et al., "Further Developments in the Brazing of Beryllium to CuCrZr", Soft-18 conference. (undated).
ITER, DOE/ER-ITER-0004, "Fusion as a Future Energy Source", U.S. Government Printing Office, 1993.
ITER, International Atomic Energy Agency, "Relevant Documents Initiating The EDA", Vienna, 1993.
Floyd et al., "Joining III: Diffusion Bonding", Beryllium Science and Technology, vol. 2, Chapter 14, pp. 275-297, 1979.
Franconi et al., "Development of Beryllium Bonds for Plasma-Facing Components", Journal of Nuclear Materials, pp. 493-498, Elsevier Science Publishers, 1992.
Watson, "High Heat Flux Issues for Plasma Facing Components in Fusion Reactors", Sandia National Laboratories, Fusion Technology Department, Presented at SPIE, San Diego, California, Jul., 1992.
Conn et al., "The International Thermonuclear Experimental Reactor", Scientific American, Apr. 1992, pp. 103-110.
Switz, "Joining I: Mechanical/Adhesive", Beryllium Science and Technology, vol. 2, Chapter 12, Plenum Publishing Corp., 1979.
Grant, "Joining II: Brazing and Soldering", Beryllium Science and Technology, vol. 2, Chapter 13, Plenum Pub. Corp., 1979.
Thomas, "Results of JET Operation with Beryllium", Journal of Nuclear Materials, pp. 3-13, Elsevier Science Publishers, 1990.
Watson, "Beryllium Joining Development", DOE Beryllium Review Panel, Sandia National Laboratory, Jun. 7, 1994.
Hanafee, "Joining Beryllium to Itself and Other Metals", Presentation to ITER Panel, Lawrence Livermore Natl. Lab., Chemistry & Materials Science Department, Jul., 1994.
McCarthy, "ES&H Issues Important To Braze Selection", Fusion Safety Program, U.S. Home Team copper Joining Workshop, Argonne National Lab, Jan. 26, 1995.
Manly et al., "Proposed Manufacturing Methods To Produce Beryllium Parts for ITER", Report of a Technical Evaluation Panel, Aug., 1995.
Sakamoto et al., "Preliminary Characterization of Interlayer for Be-Cu Functionally Gradient Materials", Journal of Nuclear Materials, 1996.
European Search Report, corresponding European Application No. EP 97 115007 .

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Bonding beryllium to copper alloys using powder metallurgy compo does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Bonding beryllium to copper alloys using powder metallurgy compo, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Bonding beryllium to copper alloys using powder metallurgy compo will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1877275

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.