Bonding apparatus with position deviation correction

Details Bonding apparatus with position deviation correction Bonding apparatus with position deviation correction

2006-05-16

2006-05-16

Koch, George (Department: 1734)

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

Automatic and/or material-triggered control

C156S358000, C156S362000, C156S378000

Reexamination Certificate

active

07044182

ABSTRACT:
A bonding apparatus that makes correction ΔX=(Xn−Xc) in positioning of bonding tool and substrate where the imaging center of first camera shows deviation +Xc with respect to the imaging center of second camera, and deviation +Xn occurs when bonding tool moves from height Z1to height Z2. A target is disposed at height Z1in a correcting position, and a correction camera is disposed beneath the target. The correction amount ΔX=(Xn−Xc)=X3−(X2+X1) is determined based upon first positional deviation X1which is the position of a chip10dat height Z1seen from the target, second positional deviation X2which is the position of the target seen from the imaging center of the second camera, and third positional deviation X3which is the position of the chip10uat height Z2seen from the imaging center of the first camera.

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