Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – With means applying wave energy or electrical energy...
Patent
1987-03-04
1989-02-14
Fisher, Richard V.
Adhesive bonding and miscellaneous chemical manufacture
Surface bonding means and/or assembly means therefor
With means applying wave energy or electrical energy...
1563809, 156381, 156497, 156546, 156556, 156578, 156579, B32B 3128
Patent
active
048044350
ABSTRACT:
Apparatus and a process for bonding a core member to a housing member, particularly, in instances in which the members do not mate in a contiguous fashion. The invention includes some manual and some semi-automatic functions, but is largely automated and computer controlled. A conveyor carries an assembly of an initially joined but unbonded core member and housing member along a series of discrete stations. After some preparatory steps in the process, an initial continuous bead of sealant is first applied on one side of the assembly to close off the space between the members and thereby form a cavity between them. The bead is cured, then the assembly is inverted and the cavity is filled with an anaerobic bonding material. A second continuous bead of sealant is then applied on the other side of the assembly to close off the remaining space between the members as well as to isolate the bonding material within the cavity. The second bead of sealant is also cured after which the fully bonded assembly is removed and replaced with a fresh assembly to be operated upon.
REFERENCES:
patent: 3960624 (1976-06-01), Erlandson
patent: 4200676 (1980-04-01), Caponigra et al.
patent: 4222635 (1980-09-01), Julke
patent: 4444806 (1984-04-01), Margan et al.
patent: 4576661 (1986-03-01), Persson
patent: 4588467 (1986-05-01), Tani et al.
patent: 4661190 (1987-04-01), Gelinas et al.
Argazzi Dennis J.
Gelinas William A.
Holtz Edwin R.
Smigel Robert L.
Wiley Dan W.
Fisher Richard V.
Loctite Corporation
Millard Wanda L.
LandOfFree
Bonding apparatus with electromagnetic wave generator does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Bonding apparatus with electromagnetic wave generator, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Bonding apparatus with electromagnetic wave generator will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1363794