Bonding apparatus for terminal component

Details Bonding apparatus for terminal component Bonding apparatus for terminal component

1995-06-29

1996-12-10

Heinrich, Samuel M.

Metal fusion bonding

With means to juxtapose and bond plural workpieces

Including compliant cushioning medium

228 62, 228 447, B23K 3704, B23K 2002

Patent

active

055823416

ABSTRACT:
A terminal component bonding apparatus is provided that has a stage for supporting a board having terminal components thereon, supporting the board. A pressure tool with a heater is set in a movable manner in a vertical direction above the stage so as to bond the terminal components to the board with heat and pressure. A shockless sheet is disposed along a lower surface of the pressure tool, and a pressing plate for terminal components is arranged along a lower surface of the shockless sheet and is made of a plate of a thermal expansion coefficient lower than that of the shockless sheet.

REFERENCES:
patent: 4657170 (1987-04-01), Muller
patent: 4913336 (1990-04-01), Yamazaki
B. Z. Hairabedian, "Resilient Ribbon Batch Soldering," IBM Tech. Discl. Bull., vol. 15., No. 6, Nov. 1972, p. 1854.

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