Bonding apparatus for electronic components

Details Bonding apparatus for electronic components Bonding apparatus for electronic components

1994-11-14

1997-01-07

Simmons, David A.

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

Automatic and/or material-triggered control

156556, 156557, 156567, 156571, B32B 3100

Patent

active

055912958

ABSTRACT:
An apparatus for bonding electronic components on a substrate with high precision and at high speed includes a table device for positioning the substrate to a bonding position, a transfer head that receives the electronic component, a rotating body with a plurality of transfer heads that rotates the transfer head to the bonding position, a recognition device that senses a deviation in position between the substrate and the electronic component which has been transferred by the transfer head to the bonding position and a driving mechanism which, according to the deviation in position sensed by the recognition device, finely displaces a lever installed on the transfer head in order to finely rotate the electronic component.

REFERENCES:
patent: 4372802 (1983-02-01), Harigane et al.
patent: 4526646 (1985-07-01), Suzuki et al.
patent: 4919746 (1990-04-01), Celia
patent: 4931128 (1990-06-01), Hamano
patent: 4980002 (1990-12-01), Dzarnoski et al.
patent: 5250144 (1993-10-01), Fitzpatrick et al.
patent: 5338381 (1994-08-01), Hidese

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