Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – Automatic and/or material-triggered control
Patent
1995-09-11
1999-04-20
Dixon, Merrick
Adhesive bonding and miscellaneous chemical manufacture
Surface bonding means and/or assembly means therefor
Automatic and/or material-triggered control
156362, 156395, 156499, 156510, 156516, 156521, 156517, 4251261, B26D 500
Patent
active
058955526
ABSTRACT:
The bonding apparatus includes a belt for feeding a label continuum (10) in which labels have been continuously formed. The label continuum fed by the belt is cut to a predetermined length to obtain a label strip by a cutter. A pressure-sensitive adhesive layer is formed on a rear surface of the label strip. The label strip obtained by the cutting operation of the cutter is fed by a belt having a label-contact surface not easily bonded to the pressure-sensitive adhesive layer. The label strip is fed to a bonding position with the pressure-sensitive adhesive layer thereof lightly bonded to the label-contact surface of the belt. The label strip fed by the belt is pressed against an object by a bonding roller serving and bonded thereto.
REFERENCES:
patent: 4707211 (1987-11-01), Shibata
patent: 5032344 (1991-07-01), Kaminski
patent: 5082439 (1992-01-01), Kaminski
patent: 5205106 (1993-04-01), Zimmermann et al.
patent: 5284667 (1994-02-01), Zimmermann et al.
patent: 5540369 (1996-07-01), Boreali et al.
Dixon Merrick
Osaka Sealing Printing Co., Ltd.
LandOfFree
Bonding apparatus for cutting label continuum having labels form does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Bonding apparatus for cutting label continuum having labels form, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Bonding apparatus for cutting label continuum having labels form will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2245942