Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2004-11-19
2008-10-07
Tsai, H. Jey (Department: 2812)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S120000, C438S613000, C257SE23021
Reexamination Certificate
active
07432129
ABSTRACT:
A method of bonding and a bonding apparatus for a semiconductor chip that apply ultrasonic vibration to the semiconductor chip to bond the semiconductor chip to a substrate carry out leveling effectively at low cost and in a short time and can improve the bonding between the semiconductor chip and the substrate. In a positioning step, bumps of the semiconductor chip and pads of the substrate are positioned and placed in contact. In a leveling step, ultrasonic vibration of a first predetermined frequency is applied to the semiconductor chip to make the bumps of the semiconductor chip and the pads of a substrate rub against each other to level the bumps. In a bonding step, ultrasonic vibration of a second predetermined frequency that differs to the first predetermined frequency is applied to the semiconductor chip to bond the bumps and pads of the semiconductor chip and the substrate.
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Fujitsu Limited
Staas & Halsey , LLP
Tsai H. Jey
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