Bonding apparatus and method

Details Bonding apparatus and method Bonding apparatus and method

2006-06-30

2009-08-18

Paschall, Mark H (Department: 3742)

Electric heating

Metal heating

By arc

C219S121480, C219S121590

Reexamination Certificate

active

07576297

ABSTRACT:
A bonding apparatus including a capillary40having a high-frequency coil50on its tip end portion and allowing a bonding wire2to pass therethrough, a position changing unit for changing the position of the tip of the bonding wire, a gas supply unit for supplying gas into the capillary, and a high-frequency power supply unit for supplying high-frequency power to the high-frequency coil. When the bonding wire is outside a plasma region52in the capillary, a microplasma generated in the plasma region is ejected out of the capillary and removes foreign matter or contaminants on the surface of a bonding subject. When the bonding wire is inside the plasma region, the material of the bonding wire is turned into fine particles, and a microplasma303containing sputtered fine particles is ejected from the capillary, allowing the material the same as the bonding wire to be deposited on the bonding subject.

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patent: 2001-015549 (2001-01-01), None
patent: 2003-328138 (2003-11-01), None

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