Bonding apparatus and bonding method of devices

Details Bonding apparatus and bonding method of devices Bonding apparatus and bonding method of devices

1995-04-27

1997-05-13

Ramsey, Kenneth J.

Electric lamp or space discharge component or device manufacturi

Process

With assembly or disassembly

228 62, 228 9, 228105, H05K 330

Patent

active

056286600

ABSTRACT:
To present means for bonding two types of devices on a display panel at high speed and at high precision.
A first feed section comprising first devices and a second feed section comprising second devices are provided. Among the display panel, first feed section, and second feed section, a turntable comprising a first nozzle for picking up first devices and a second nozzle for picking up second devices is provided.
Between the turntable and display panel, a first head for bonding the first device sucked in vacuum to the first nozzle to a longer side of the display panel, and a second head for bonding the second device sucked in vacuum to the second nozzle to a shorter side of the display panel are provided.

REFERENCES:
patent: 4501064 (1985-02-01), Di Nozzi et al.
patent: 4934578 (1990-06-01), Fritsch

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