Bonding apparatus and bonding method having process for...

Details Bonding apparatus and bonding method having process for... Bonding apparatus and bonding method having process for...

2005-11-08

2005-11-08

Cooke, Colleen P. (Department: 1754)

Metal fusion bonding

Means to apply vibratory solid-state bonding energy to work

C228S056500, C228S104000

Reexamination Certificate

active

06962281

ABSTRACT:
In a bonding apparatus having an ultrasonic horn3coupled to an ultrasonic vibrator5and a bonding tool4coupled to the ultrasonic horn3, and applying ultrasonic bonding to a work11, by providing an ultrasonic detector7and an indicator8for displaying an output signal from the ultrasonic detector7, there is obtained a bonding method that can easily make a good or bad judgment on the bonding state based on the output signal of the ultrasonic detector. With this arrangement, ultrasonic vibration of the bonding tool in the bonding apparatus using ultrasonic waves is constantly monitored, thereby reducing occurrence of bonding failure and making definite the time for replacing the bonding tool.

REFERENCES:
patent: 4641527 (1987-02-01), Hiroi et al.
patent: 4854494 (1989-08-01), von Raben
patent: 5431324 (1995-07-01), Kajiwara et al.
patent: 6181431 (2001-01-01), Siu
patent: 6233045 (2001-05-01), Suni et al.
patent: 6279810 (2001-08-01), Chan-Wong et al.
patent: 6490047 (2002-12-01), Siu
patent: 6543668 (2003-04-01), Fujii et al.
patent: 6628408 (2003-09-01), Franklin et al.
patent: S63-191927 (1988-08-01), None
patent: H07-335700 (1995-12-01), None
patent: H09-148385 (1997-06-01), None
patent: 10-326811 (1998-12-01), None

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