Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – With work feeding or handling means
Reexamination Certificate
2011-03-29
2011-03-29
Tucker, Philip C (Department: 1745)
Adhesive bonding and miscellaneous chemical manufacture
Surface bonding means and/or assembly means therefor
With work feeding or handling means
C156S275500, C156S286000, C156S379800
Reexamination Certificate
active
07913737
ABSTRACT:
The present invention provides a bonding apparatus and bonding method which can prevent warping of substrates by ensuring a sufficient standing time following bonding of the substrates, using a simple and compact apparatus. Substrate carrying parts1aare formed along the circumference of a rotating turntable1. The respective substrate carrying parts1aare formed so that these parts pass through substrate placement positions11and12, a bonding position13, pre-curing standing positions14athrough14d, a curing position15, a post-curing standing position16and a conveying position17as the turntable1rotates. After being bonded in the bonding position13, the substrates move through the pre-curing standing positions14athrough14das a result of the rotation of the turntable1, and are allowed to stand for a fixed period of time, so that warping is corrected.
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English translation of Kotoyori, Masahiko (JP 2002-074759): Method and Device for Laminating Optical Disk; Mar. 15, 2002.
English translation of Hosogai, Nobukazu (JP 10-289491): DVD Bonding Apparatus; Oct. 27, 1998.
Nishigaki Hisashi
Takeuchi Hachiya
Tanabe Shohei
Shibaura Mechatronics Corporation
Slawski Brian R
Tucker Philip C
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