Bonding apparatus and bonding method

Details Bonding apparatus and bonding method Bonding apparatus and bonding method

1994-03-23

1995-08-22

Rosenbaum, Mark

Metal fusion bonding

Process

With condition responsive, program, or timing control

228 45, 228 62, 228 8, B23K 2000

Patent

active

054432006

ABSTRACT:
An apparatus for bonding such as wire bonding or inner lead bonding comprises a holding unit for holding an object to be bonded, a supporting unit for mounting thereto the holding unit, a driving unit for moving upwardly and downwardly the supporting unit, and a drive control circuit for controlling the driving unit in accordance with stored information about operations of the supporting member. The bonding apparatus includes a control unit for changing a gain characteristic of the drive control circuit from a high gain characteristic to a low gain characteristic while the holding unit is caused to descend before this holding unit is contacted onto a bonding surface.

REFERENCES:
patent: 4444349 (1984-04-01), Bilane et al.
patent: 4696425 (1987-09-01), Landes
patent: 5011061 (1991-04-01), Funatsu

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