Bonding apparatus

Details Bonding apparatus Bonding apparatus

2005-12-23

2010-11-30

Hoang, Tu B (Department: 3742)

Electric heating

Metal heating

Wire, rod, or bar bonding

C228S004500, C228S179100

Reexamination Certificate

active

07842897

ABSTRACT:
A wire bonding apparatus including a joining machine unit for joining a wire to a subject device, a measurement unit for measuring the connection state between the subject device and the wire, and a control unit for controlling the operation of the entire apparatus. An AC-C measurement circuit of the measurement unit includes an AC power supply, an equivalent capacitance circuit that creates an essentially the same capacitance as the capacitance component of the joining machine unit before bonding, a differential circuit that finds the difference between the capacitance of the joining machine unit after bonding and the capacitance of the equivalent capacitance circuit, an amplification circuit, a rectification circuit, an AID conversion circuit, a judgment unit that judges the connection state, and an output unit.

REFERENCES:
patent: 3283577 (1966-11-01), Schuck
patent: 5110032 (1992-05-01), Akiyama et al.
patent: 5468927 (1995-11-01), Terakado
patent: 5889210 (1999-03-01), Inoue
patent: 6750734 (2004-06-01), Utsunomiya et al.
patent: 9-213752 (1997-08-01), None
patent: 11176868 (1999-07-01), None
Chapter 3.2 of Book “Application-Specific Integrated Circuits” (ISBN: 0201500221) by Smith, Michael John Sebastian, published by Addison-Wesley Longman Inc.

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