Bonding apparatus

Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – Automatic and/or material-triggered control

Reexamination Certificate

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Details

C156S360000, C156S378000, C156S566000, C228S004500, C228S008000, C228S012000, C228S032000, C228S045000

Reexamination Certificate

active

07096912

ABSTRACT:
A bonding apparatus including, on a supporting stand12,two linear motors130and140and a bonding head supporting stage114which supports the bonding head120by means of fluid pressure so that the bonding head120is movable in the horizontal plane. The linear motors130and140respectively include driving sections132and142and movable coil assemblies134and144.An arm136extending from the movable coil assembly134of the first linear motor130is fastened to the bonding head120,and an arm146extending from the movable coil assembly144of the second linear motor140is engaged with the bonding head120.A driving force aimed at the center of gravity of the bonding head120is applied to the bonding head120via the arms136and146,so that the bonding head120is moved.

REFERENCES:
patent: 5556022 (1996-09-01), Orcutt et al.
patent: 6059169 (2000-05-01), Nihei et al.
patent: 2002-329772 (2002-11-01), None
Machine Translation of JP 2004-319958 (priority document).

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