Bonding apparatus

Details Bonding apparatus Bonding apparatus

1992-04-15

1994-08-23

Heinrich, Samuel M.

Metal fusion bonding

Means to apply vibratory solid-state bonding energy to work

2281101, H01C 21607, B23K 2010

Patent

active

053400100

ABSTRACT:
This invention is intended to reduce the size of a bonding apparatus and includes a first means which is to construct the bonding apparatus by swingably mounting a lifter arm 4 for holding a horn 2 to the upper Y table 9 of an X-Y table 10. The second means is to construct the apparatus by using the upper Y table of the X-Y table as a bottom plate of a bonding head, and the third means is that in addition to the second means, it is further arranged so that a linear motor 15 is fixed such that a part or the entire portion of a magnet section 16 of the linear motor 15 is embedded in the Y table 9, while a coil section 17 of the linear motor 15 is fixed to the lifter arm 4.

REFERENCES:
patent: 5060841 (1991-10-01), Oshima et al.
patent: 5115960 (1992-05-01), Shimizu
patent: 5158223 (1992-10-01), Shimizu
patent: 5221037 (1993-06-01), Terakado et al.

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