Bonding apparatus

Details Bonding apparatus Bonding apparatus

2008-01-29

2008-01-29

Desire, Gregory M (Department: 2624)

Image analysis

Applications

Manufacturing or product inspection

C156S351000, C156S358000, C228S103000, C324S765010, C382S218000, C382S294000

Reexamination Certificate

active

07324684

ABSTRACT:
With an assumption that the three data of the position (X1, Y1) of the first positioning pattern202and position (X2, Y2) of the second positioning pattern212of the reference chip200, and the position (X3, Y3) of the first positioning pattern232of the bonding object chip230, as well as the length L of a line segment connecting (X1, Y1) and (X2, Y2), and the angle θ2of this line segment with respect to the X axis, are known, the coordinates (X4, Y4) of the center position of the imaging range250that is to be imaged next is determined by detecting the inclination-angle Δθ of the first positioning pattern232of the bonding object chip230. Furthermore, the imaging range can be narrowed and the second positioning pattern252can be captured by increasing the precision of Δθ.

REFERENCES:
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patent: 7224829 (2007-05-01), Enokido
patent: 2007/0036423 (2007-02-01), Enokido
patent: 2007/0036424 (2007-02-01), Enokido
patent: 2007/0041632 (2007-02-01), Enokido et al.
patent: 63-56764 (1988-03-01), None
patent: 2864735 (1999-03-01), None
patent: 2002-208010 (2002-07-01), None

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