Bonding apparatus

Details Bonding apparatus Bonding apparatus

1997-12-30

2000-06-06

Ryan, Patrick

Metal fusion bonding

Including means to force or clamp work portions together...

Work portion comprises electrical component

228 45, 228 62, 228 495, B23K 3700, B23K 100, B23K 1500, B23K 3704

Patent

active

060707801

ABSTRACT:
A bonding device equipped with a heating block for heating, for instance, a lead frame upon which bonding is performed including vacuum suction nozzles, which are installed above the heating block so as to lift the lead frame, and an air-cylinder, which raises and lowers the vacuum suction nozzles. The lead frame is lifted from the heating block by the vacuum suction nozzles, thus being prevented from being overly heated by the heating block.

REFERENCES:
patent: 4166562 (1979-09-01), Keizer et al.
patent: 5009590 (1991-04-01), Mitarai et al.
patent: 5082165 (1992-01-01), Ishizuka
patent: 5201450 (1993-04-01), Ahn
patent: 5579980 (1996-12-01), Ichikawa
patent: 5579985 (1996-12-01), Ichikawa
patent: 5749442 (1998-05-01), Kikuchi

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