Bonding apparatus

Details Bonding apparatus Bonding apparatus

1997-11-25

1999-05-04

Simmons, David A.

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

Automatic and/or material-triggered control

156363, 156378, 156379, 382145, 382151, 382152, 228 45, 228105, 2281805, B05B 500, B32B 3100, G06K 900, B23B 3700

Patent

active

059001062

ABSTRACT:
In a wire bonding apparatus in which images of workpieces placed on a heating block so as to be bonded are taken by a camera through an optical path housing in which an optical path from the workpiece to the camera is established, heaters are installed on the optical path housing so as to heat the optical path housing at a constant temperature which is higher than the temperature that is affected by the heating block.

REFERENCES:
patent: 5501388 (1996-03-01), Takeuchi
patent: 5667130 (1997-09-01), Morita et al.
patent: 5720424 (1998-02-01), Takeuchi

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