Bonding apparatus

Details Bonding apparatus Bonding apparatus

1992-12-18

1994-05-31

Simmons, David A.

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

With means applying wave energy or electrical energy...

29729, 29739, 29740, B27G 1102, B31F 504, B32B 3124

Patent

active

053166108

ABSTRACT:
A depression jig, having a depression chip and a holder for holding the depression chip, is provided which depresses against a wiring substrate a semiconductor chip placed on the wiring substrate. The holder has portions defining penetrations vertically running through the holder. Optical fibers are inserted into the penetrations. A light ray radiates from the optical fiber. The light ray is incident upon the top surface of the depression chip, enters the depression chip, is reflected from a side surface of the depression chip onto the undersurface of the depression chip, and is emitted from the undersurface of the depression chip as an outgoing light ray. A photo-curing resin supplied between the semiconductor chip and the wiring substrate is irradiated with such an outgoing light ray, so that the photo-curing resin hardens.

REFERENCES:
patent: 3531852 (1970-10-01), Slemmons et al.
patent: 4603803 (1986-08-01), Chan et al.
patent: 4749120 (1988-06-01), Hatada
patent: 5037780 (1991-08-01), Fujimoto et al.
patent: 5115545 (1992-05-01), Fujimoto et al.
patent: 5173147 (1992-12-01), Shimoyama et al.

Affiliated with

Also associated with

Rating

Bonding apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Bonding apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Bonding apparatus will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1625777