Bonding apparatus

Details Bonding apparatus Bonding apparatus

1999-02-12

2000-12-19

Ryan, Patrick

Metal fusion bonding

With means to juxtapose and bond plural workpieces

Wire lead bonder

228178, 2281805, B23K 3700, B23K 3102, B23K 3100

Patent

active

061617474

ABSTRACT:
In a bonding apparatus such as a bump bonding apparatus, tape bonding apparatus or the like, a positioning claw which is used for positioning a semiconductor pellet on a bonding stage of the bonding apparatus is provided on a bonding head or on an XY table on which the bonding head is installed.

REFERENCES:
patent: 5951283 (1999-09-01), Ushiki et al.

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