Bonding and inspection system

Metal fusion bonding – With control means responsive to sensed condition – Work-responsive

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

228 62, 228 491, 228103, B23K 3704, B23Q 1600

Patent

active

06135340&

ABSTRACT:
A system and method that permits the accuracy of alignment of a transparent substrate relative to a second substrate to which it is bonded to be evaluated on-line, after the two substrates have been bonded together. The alignment of the two substrates is viewed through the transparent substrate as the bonded-together substrates are being transported between the station at which the bonding occurred and another processing station.

REFERENCES:
patent: 3838274 (1974-09-01), Doubek, Jr. et al.
patent: 4052603 (1977-10-01), Karlson
patent: 4568189 (1986-02-01), Bass et al.
patent: 4606643 (1986-08-01), Tam
patent: 4945407 (1990-07-01), Winnek
patent: 5022580 (1991-06-01), Pedder
patent: 5042709 (1991-08-01), Cina et al.
patent: 5633103 (1997-05-01), DeMarco et al.
patent: 5634585 (1997-06-01), Stansbury
patent: 5639323 (1997-06-01), Jordan
patent: 5649847 (1997-07-01), Haven
patent: 5661601 (1997-08-01), Kang et al.
patent: 5807154 (1998-09-01), Watkins
patent: 5876884 (1999-03-01), Maeda et al.
patent: 5886971 (1999-03-01), Feldman et al.
patent: 5895554 (1999-04-01), Gordon
patent: 5896158 (1999-04-01), Brenner, Jr. et al.
patent: 5923990 (1999-07-01), Miura
patent: 5984748 (1999-11-01), Ritter et al.
Automated Flip Chip Bonder, AFC 101 AP, RD Automaticn, Piscataway, New Jersey.
Hughes Model 3500, Automatic Component Assembly Cell, Hughes Aircraft Company, Carlsbad, CA, 1994.
Iversen, Wesley R., "Component placement and insertion review;" includes related article; Cover Story, vol. 36, No. 1, p. 14; ISSN: 1050-8171, Jan. 1993, Copyright Hitchcock Publishing Company 1993.
LeFort, Bob; Constaninou, Tat, "Ultra-miniature surface mount semiconductors", Copyright Society of Automotive Engineers Inc., 1989--Automotive Engineering.
Microwave Journal, vol. 38, No. 2, Feb., 1995, p. 128, "Polymer flip chip Psub fC: a solderless bump process", Copyright 1195 Horizon House Publications Inc.
MRSI-503M, Precision Flip Chip Die Assembly System View: Up/Down, Micro Robotics Systems, Inc., Chelmsford, MA.
MicroPlace 1000F--Flip Chip Assembly System, SIERRA Research and Technology, Inc., Westford, MA.
MicroPlace 2000F--Flip Chip Assembly Systems, SIERRA Research and Technology, Inc., Westford, MA.
Panasonic, Doc. No. TI-645-0793 Specifications, Flip Chip Bonder, Panasert BF, Mitsushita Electric Industrial Co., Ltd.
The First Assembly System for the 21st Century, ZEVATECH Inc., Morrisville, NC, Feb. 1993.
The Multi-Function Precision Assembly System, ZEVATECH Inc., Morrisville, NC, Oct. 1993.
Universal Flip Chip Bonder--Model FC950, ULTRA t Equipment Co., Fremont, CA .

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Bonding and inspection system does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Bonding and inspection system, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Bonding and inspection system will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1955283

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.