Bonding additives for refractory metallization inks

Details Bonding additives for refractory metallization inks Bonding additives for refractory metallization inks

1988-06-16

1990-01-16

Robinson, Ellis P.

Stock material or miscellaneous articles

Structurally defined web or sheet

Including aperture

428209, 428210, 428426, 428432, 428433, 428901, 428689, 428697, 106 112, 106 121, 106 124, 106 127, 106 128, 75233, 75235, 75245, 75248, 252508, 252513, 252514, 252515, 252516, B32B 310

Patent

active

048942731

ABSTRACT:
Bonding additives for refractory metallization compositions allow for circuit traces having good resistivities and adhesion values in excess of 6 kpsi, generally between about 10 and 20 kpsi. The inks are provided in formulations devoid of a glass component, and are suitable for co-sintering circuit traces and vias with 96% alumina substrates, and especially for 99% alumina substrates. Suitable bonding additives are the oxides of molybdenum, tungsten, niobium, manganese, yttrium, and titanium, or mixtures of such oxides.

REFERENCES:
patent: 4340618 (1982-07-01), Fury et al.
patent: 4684446 (1987-08-01), Charles et al.

Affiliated with

Also associated with

Rating

Bonding additives for refractory metallization inks does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Bonding additives for refractory metallization inks, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Bonding additives for refractory metallization inks will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1334208