Bondhead lead clamp apparatus and method

Details Bondhead lead clamp apparatus and method Bondhead lead clamp apparatus and method

2005-01-04

2005-01-04

Stoner, Kiley (Department: 1725)

Metal fusion bonding

Process

Plural joints

C228S044700, C228S212000

Reexamination Certificate

active

06837418

ABSTRACT:
A method of forming improved wire bonds between the contact pads on semiconductor devices and individual lead frame fingers of a lead frame. The method includes the use of an individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding. If desired, the method also provides for the use of a conventional fixed clamp for the lead fingers during the wire bonding process in addition to the individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding and also provides for the replacement of the fixed clamp with another, or second, independent clamp.

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