Metal fusion bonding – Process – Plural joints
Patent
1996-02-06
1997-07-15
Heinrich, Samuel M.
Metal fusion bonding
Process
Plural joints
228212, 228 495, H01L 2160, B23K 3704
Patent
active
056475284
ABSTRACT:
An apparatus and method of forming improved wire bonds between the contact pads on semiconductor devices and individual lead frame fingers of a lead frame. The present invention includes the use of an individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding. If desired, the present invention also provides for the use of a conventional fixed clamp for the lead fingers during the wire bonding process in addition to the individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding. The present invention also contemplates the replacement of the fixed clamp with another, or second, independent clamp in addition to the first individual independent lead finger clamp during the wire bonding process.
REFERENCES:
patent: 3566207 (1971-02-01), Adams
patent: 3685137 (1972-08-01), Gardiner
patent: 4030657 (1977-06-01), Scheffer
patent: 4361261 (1982-11-01), Elles et al.
patent: 4434347 (1984-02-01), Kurtz et al.
patent: 4527730 (1985-07-01), Shirai et al.
patent: 4600138 (1986-07-01), Hill
patent: 4603803 (1986-08-01), Chan et al.
patent: 4653681 (1987-03-01), Dreibelbis et al.
patent: 4765531 (1988-08-01), Ricketson et al.
patent: 4778097 (1988-10-01), Hauser
patent: 4821945 (1989-04-01), Chase et al.
patent: 5035034 (1991-07-01), Cotney
patent: 5114066 (1992-05-01), Amador et al.
patent: 5148959 (1992-09-01), Cain et al.
patent: 5197652 (1993-03-01), Yamazaki
patent: 5217154 (1993-06-01), Elwood et al.
patent: 5307978 (1994-05-01), Ricketson et al.
patent: 5322207 (1994-06-01), Fogal et al.
patent: 5384155 (1995-01-01), Abbott et al.
patent: 5421503 (1995-06-01), Perlberg et al.
patent: 5425491 (1995-06-01), Tanaka et al.
patent: 5445306 (1995-08-01), Huddleston
patent: 5465899 (1995-11-01), Quick et al.
H.K. Charles, Jr.; "Electrical Interconnection"; pp. 224-236.
Ball Michael B.
Fogal Rich
Heinrich Samuel M.
Micro)n Technology, Inc.
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