Bondhead for wire bonding apparatus

Details Bondhead for wire bonding apparatus Bondhead for wire bonding apparatus

2006-04-11

2006-04-11

Edmondson, Lynne R. (Department: 1725)

Metal fusion bonding

With means to juxtapose and bond plural workpieces

Wire lead bonder

C228S180500

Reexamination Certificate

active

07025243

ABSTRACT:
A bondhead is provided that comprises a bondhead body for holding a bonding tool, such as an ultrasonic transducer, and a bondhead actuator coupled to the bondhead body for moving the bonding tool with respect to a bonding surface. A wire clamping device, which may comprise a wire clamp holder and a wire clamp, is movable relative to the bondhead body for feeding a bonding wire to the bonding tool. A wire clamping device actuator is operative to move the wire clamping device relative to the bondhead body for improved control of the feeding of bonding wire to the bonding tool.

REFERENCES:
patent: 3216640 (1965-11-01), Szasz
patent: 3806019 (1974-04-01), Diepeveen
patent: 4213556 (1980-07-01), Persson et al.
patent: 4234117 (1980-11-01), Foulke
patent: 5277355 (1994-01-01), Weaver et al.
patent: 5868300 (1999-02-01), Babayan
patent: 6102275 (2000-08-01), Hill et al.
patent: 6435399 (2002-08-01), Ikoma
patent: 6616030 (2003-09-01), Miller
patent: 59-220939 (1984-12-01), None

Affiliated with

Also associated with

Rating

Bondhead for wire bonding apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Bondhead for wire bonding apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Bondhead for wire bonding apparatus will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3587145